IDW30G120C5BFKSA1
 
										 
																					IDW30G120C5BFKSA1
												
													Description: 
													SiC-D 1200V 30A 1,4V TO247-3
												
																									
														Produttore:
																																											INFINEON
																											
																																					
														Matchcode:
														IDW30G120C5B
													
																																					
														Rutronik No.:
														DSKY4845
													
																																				
													VPE:
													30
												
																									
														MOQ:
														240
													
																																					
														dimensioni:
														TO247-3
													
																																					
														confezione:
														TUBE
													
																							
										
																		
										
										
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- V(RRM)
- 1200 V
- I(F)per diode
- 15 A
- I(FSM)
- 115 A
- V(F)
- 1.4 V
- Technology
- 5thinQ!SiC
- Automotive
- NO
- Package
- TO247-3
- RoHS Status
- RoHS-conform
- Tipo di confezione
- TUBE
- Configuration
- CommonCath
- Mounting
- THT
- T(j) max
- 175 °C
- Articolo produttore
- SP001123716
- EAR99
- Numero di tariffa doganale
- 85411000000
- Stato
- China
- Codice- ABC
- A
- Tempo di consegna standard
- 28 Settimane
								The CoolSiC™ Schottky diode generation 5 1200 V, 30 A in a TO-247-3 package, presents a leading edge technology for SiC Schottky Barrier diodes. The thin wafer technology, already introduced with G2, is now combined with a new merged pn junction improving diode surge current capabilities. The result is a series of products delivering market leading efficiency and more system reliability at an attractive cost point.
											Summary of Features
- Best-in-class forward voltage (VF)
- No reverse recovery charge
- Mild positive temperature dependency of VF
- Best-in-class surge current capability
- Excellent thermal performance
Benefits
- Highest system efficiency
- Improved system efficiency at low switching frequencies
- Increased power density at high switching frequencies
- Higher system reliability
- Reduced EMI
