104977
104977
Description:
Active Cooler LGA1700 incl. Backplate
Produttore:
HSM ZAMECKI
Matchcode:
S3SA-DSD1-E121Z
Rutronik No.:
DISACC1632
VPE:
1
MOQ:
1
confezione:
BOX
Trova alternative
datasheet/scheda tecnica
aggiungi al progetto
Campionature
Download the free Library Loader to convert this file for your ECAD Tool
- Cooling solutio
- ACTIVE
- Fan connector
- 4-PIN PWM
- Heatpipe incl.
- Y Y/N
- Mounting
- SCREWS
- Cassis height
- 4U
- Accessory
- BACKPLATE
- Socket type
- LGA1700
- Cooler material
- COMPOUND
- Height
- 100 mm
- Width
- 92 mm
- Length
- 95 mm
- Weight
- 500 g
- Matching board
- DISACC1751
- Automotive
- NO
- RoHS Status
- RoHS-conform
- Tipo di confezione
- BOX
- EAR99
- Numero di tariffa doganale
- 84733080000
- Stato
- Taiwan
- Codice- ABC
- A
- Tempo di consegna standard
- 15 Settimane
Active cooling solution designed for Alder Lake / Raptor Lake processors based on the LGA1700 socket. The 3U active aluminum heatsink with copper base and 4 heat pipes consists of Cooler and Backplate.
- Heatsink Material: Aluminum with copper base and 4 heat pipes
- Fastener: Screw & Spring
- PWM Fan: F129025BUAF4Q8aR with two ball bearing
- Fan Speed: 800 - 3450 rpm, Air Flow: 16.29 - 70.24 CFM, Noise Level: 21 - 43 dB-A
- Dimensions (L x W x H): 95 x 92 x 103 [mm]
- Weight: 457 g
- Thermal Material: X23-7762
- Thermal Resistance: 0.152 °C/W
- RoHS & REACh compliant
- Made in PRC
